LOCTITE ABLESTIK ABP 8068TB is a semi silver sintered chip adhesive designed specifically for semiconductor packaging with high heat and conductivity requirements. Its formula has stronger resin leakage control ability than its predecessor LOTITE ABLEBSTIK ABP 8068TA. LOCTITE ABLESTIK ABP 8068TB is designed to provide high adhesion and low stress, which are crucial for the thermal performance and reliability of high-end power packaging. The thermal performance of this material is comparable to that of solder paste products.

• No resin outflow

• Good processability

• In silver, PPF， When used on gold and copper substrates, it has good sintering performance as a single component

  Technical information
  Coefficient of thermal expansion	25 ppm/°C
  Curing method	Heating solidification
  Viscosity, Bolefi CP51@ 25 °C Speed 5 rpm	11500 mPa.s (cP)
  Thixotropic index	five point five